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PEEK-Tough Tape Best Applications List

No.13 Flow and reflow soldering process for printed circuit board, masking the Gold Plate Contact

Saturday September 15th, 2012 HEAT-TECH info

INDEX

  • [ Problem Point ]
      • [ Kaizen Point ]

[ Problem Point ]

Heat resistance is required to protect a golden terminal from cream solder.

[ Kaizen Point ]

The Toughtape was used and masked.

It is improvement in reliability at sufficient heat resistance.

Related page:

No.16 Soldering of printed circuit board No.29 Preheating of printed circuit board No.4 Reflow of printed circuit boards No.1 Soldering of printed circuit boards No.75 Aging of Printed Circuit Board No.2 Preheating of the printed circuit board No.15 Printed circuit board cooling No.12 Cold air cooling of Mounted printed circuit board

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