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No.6 Heat dry feedback control of a Epoxy Base package

No.5 Heat dry feedback control of a Epoxy Base package

[ Problem Point ]

It took a certain amount of curing at a stable temperature without overshoot.

[ ⇒Kaizen Point ]

Using the heat retention time control function of highly functional heater controller HHC2.
The heating time was tested in increments of 1 second.

Since the resin is weak to overshoot, the overshoot zero function was used.

It was able to easily change the heat retention time by mounting a timer on the board surface.

An availability and the margin could be grasped easily, so it could be introduced into a line surely.

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