[ Problem Point ]
We were looking for a way to pinpoint and rework poor solder joints during the reflow process.
[ ⇒Kaizen Point ]
Because the heating can be pinpointed, there is less impact on other solder joints and it does not have to be put into the reflow oven again, so the printed circuit board itself can be reused without being damaged.
Related page:
No.13 Flow and reflow soldering process for printed circuit board, masking the Gold Plate Contact 
No.4 Reflow of printed circuit boards 
No.1 Feedback control of halogen heater for solder melting 
No.80 Drying of silicon powder in the process of recycling waste liquid discharged from the semiconductor manufacturing process 
No.29 Preheating of printed circuit board 
Pinpoint heating of solder 
No.2 Preheating of the printed circuit board 
No.84 Heating in wire drawing process