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No.13 Flow and reflow soldering process for printed circuit board, masking the Gold Plate Contact

Flow and reflow soldering process for printed circuit board, masking the Gold Plate Contact by the PEEK "Tough tape"

[ Problem Point ]

Heat resistance is required to protect a golden terminal from cream solder.

[ Kaizen Point ]

The Toughtape was used and masked.

It is improvement in reliability at sufficient heat resistance.