[ Problem Point ]
I intended to shorten the dry time for epoxy base package, but was not able to temperature-control it by non-contact.
[ ⇒Kaizen Point ]
Thermocontroller for a pyrometer was mounted on the High-performance heater controller HHC2 and controlled by the signal of the pyrometer.
Since heating control can be done without contacting the package, the possibility of “hit defect” disappeared.
Furthermore, even if the height of the part changed, it was able to heat from the same position, so the number of steps for changeover was reduced.
Moreover, since there are manual and automatic changeover switches, conditions can be easily settled.