[ Problem Point ]
The annealing process of SiC wafers requires uniform heating at high temperatures, while improving throughput remains a challenge.
[ ⇒Kaizen Point ]
By using the Carbon line heater, heating efficiency has improved.
Throughput has increased, and the compact design contributes to space-saving.
Furthermore, energy efficiency in high-temperature processes has also been enhanced.
Related page:
No.14 Shortening the Drying Time of the Coater 
No.15 Small Lot Drying of Resin Pellets 
No.86 Annealing small parts on the production line 
No.80 Drying of silicon powder in the process of recycling waste liquid discharged from the semiconductor manufacturing process 
No.1 Drying 300mm silicon wafers after precision cleaning 
No.2 Dryness of medicine of paper-forming process 
No.7 Curing the powder coating drying process 
3-5.Balance of the process